Jetson AGX Orin 32GB H01 Kit is built with Jetson AGX Orin 32GB Module, offering 200 TOPs AI performance as well as a carrier board including PCIe X16, GbE, 10GbE, 3* USB 3.2, HDMI 2.1, M.2 Key M, M.2 Key E, 2.4/5GHz Wi-Fi, Bluetooth, 16 lane MIPI CSI-2, 40-Pin header. The kit is pre-installed with JetPack 5.0.2, has a heatsink with a cooling fan and an aluminum case, while being an alternative option for the Jetson AGX Orin Dev Kit.
Jetson AGX Orin 32GB H01 Kit WiFi Bluetooth Pre-installed JetPack System
$2,850.00Price
- Brilliant AI Performance for production: on-device processing with up to 200 TOPS AI performance with low power and low latency.
- Hand-size edge AI device: compact size at 107mm x 106.4mm x 70.5mm, includes Jetson AGX Orin™ production module, a heatsink with a cooling fan, enclosure, and a power adapter.
- Expandable with rich I/Os: PCIe X16, GbE, 10GbE, 3x USB 3.2, HDMI 2.1, M.2 Key M, M.2 Key E, 2.4/5GHz Wi-Fi, Bluetooth, 16 lane MIPI CSI-2, 40-Pin header.
- Accelerate solution to market: pre-installed JetPack 5.0.2, Linux OS BSP, support Jetson software and leading AI frameworks and software platforms.